David K. Quinn (Principle: Quinn Embedded Design Inc.)

484-225-8663 

Jim Thorpe, Pennsylvania

DavidKQuinn@aol.com                                  

 

Introduction:  Consultant: Custom electronic design capabilities in Microcontroller, Digital, Analog, Mixed-Signal and Power Supply systems. I also offer 20+ years experience in Firmware  (â�œCâ� and Assembly).  Career encompasses contributions to product development and design with intuitive and in depth electronic and firmware Engineering.  I offer a hands-on approach to Engineering design, organization, manufacturing, and documentation.  To add: I donâ�™t consider an engineering job complete until all subsequent documentation has been completed.  I can and have acted as Project Lead / Manager, liaison to Production, Purchasing, C.E.M.s, Technical Support, and Component Engineering. Recognized as an out-of-the-box thinker and leader who can optimize a manufacturing operation, helping a facility maintain its competitiveness and market dominant position.  I have worked with DOD directives and have knowledge of Six Sigma programs.  Additionally, I offer knowledge of RoHS / WEEE compliant component qualification, containing limited lead and other toxins.

 

Strengths and Applications:

·         25+ years of hardware design: Digital, Analog (Including Professional Audio), Mixed-Signal & Power Supply.

·         22 years C / C++ / Assembly language experience with OOA/OOD/OOP approach.  Used RTOS & Emulators.

·         Knowledgeable in Safety related design, (creepage/clearance/grounding) as required by standards such as IEC 60950.

·         Switching Power Supply design (Integrated switchers and controller based discrete), typically 90+% efficient.

·         Board Level Design: Discrete component level, up to high-density Digital / Linear integrated circuits.

·         Analog IC Design experience: Analog ASICs, Op-Amps, Mixed Signal, Audio and Power Supply controllers.

·         Digital IC Design experience, Logic families: CMOS: CD4000, HC, VHC, LVC, LVT, LVX. Bipolar: TTL/LSTTL.

·         Detailed understanding of timing & logic voltage thresholds employed in successful and bug-free digital designs.

·         High Power Peripheral Drivers for driving solenoids, motors, flow controllers, flow sensors & proportional valves.

·         Motor Control Servo-Loop applications, Including Actuators using Wheatstone Bridge (i.e., Load-Cells) and resolution tracking resolver to digital converter for angular motor position tracking.

·         Use Spice and Excel for calculations, simulation and documentation.

·         Custom PLDs, CPLDs, FPGAs and ASICs with on-board mixed signal.

·         LVDS typically used in LCD displays.

·         RS-232, RS-422, RS-485, USB 2.0, I2C (IIC), Ethernet, CAN, Infrared Networking.

·         Microcontrollers: PIC, MSP430, 8051, 8052, 8031, 8032, Z80, 68xx, 6502, X86, 8748, 8749, T.I. TMS320 .

·         Schematic Capture Using: Mentor Graphics (Very Best),  PADs, &  Orcad  (and others) / with Spice if required.

·         RF: FCC part-15, EMI / EMC compliance, Miniature transmitter design, Microwave (during military).

·         Telephony and Modem: FCC part-68 (to the DAA level), (North American and International POTs).

·         Battery charger design: Sealed Lead Acid, Nickel Metal Hydride and Lithium Ion.

·         Experienced with MDB used in bill acceptors and coin hoppers.

·         Component Engineering: work closely with suppliers and manufacturers (CEMs / BOMs), qualify samples.

·         Documentation: BOMs, work closely with CAD, Production, Tech. Support and Purchasing.

 

Experience:

Quinn Embedded Design Inc. Private Consulting (Sep2008 â�“ Current)                     Sr. Design Engineer (Consultant).

Self Employed Consultant: Current projects include Microcontroller based High Powered LED driver design.  Additionally, a Microcontroller Emulation Pressure sensor project is in progress.

 

BAE Systems: Jun2007 â�“ Sep2008                                                                            Sr. Design Engineer (Consultant).

Responsible for product support on the Hybrid Drive Program.  My responsibilities include troubleshooting complex analog and digital circuits centrally interfaced and controlled by a Freescale MPC5554 Microcontroller. I was also responsible for revising the designs and resolving multiple problems before being employed in the vehicle.

 

SESI Inc: Mar2007 â�“ Jun2007                                                                                  Sr. Design Engineer (Consultant).

This was a short term assignment.  I was brought in as a team leader for a small Microcontroller design project.  Responsible for the design and debug a new control board used on Ultraviolet Biological Trigger Lidar (UBTL).  This project used the TI MSP430 CPU.  I was responsible for Hardware and Firmware on this short-term project, which was completed in ~9 weeks.

 

Experience Continued:

Goodrich Corp: Mar2006 â�“ Mar2007                                                                         Sr. Design Engineer (Contractor).

Member of aircraft braking system design team.  Responsibilities: Implement and refine Load-Cell circuitry using Analog Devices AD7731 device.  System integration, provide Load-Cell readings to system using SPI  interface for  DSP / Actuator Feedback.  Responsible for Power Supply, Mother Board, / production liaison.

 

General Dynamics: Sep2005 â�“ Jan2006                                                                     Sr. Design Engineer (Contractor).

Project Leader: Redesign / Product support of classified Mil. Spec. turret program on light armored vehicles. Nature of work was Microcontroller, DSP, and power supply controller. Also, lead team on debug effort on gyroscope problem.

 

Quinn Embedded Design, under contract at Avanex: Mar2005 â�“ Jul2005                  Sr. Design Engineer (Contractor).

·         Production Tester Design, Project Leader: This project involved the design of a manufacturing tester from concept to completion. Main CPU: PIC18F8722 / USB 2.0 Co-Processor: PIC18F2455.  Circuit types employed:  50W Adj. National Semi LM3485 based Switching Power Supply controlled by I2C from CPU interface, USB 2.0 Compliant Port, Two High-speed (230K) RS-232 ports.  I/O protected by TVS devices. Authored low-level firmware drivers in â�œCâ� for PCB test and debug.  Technologies Employed: High Speed CMOS Logic, Analog, Mixed-signal & Switching Power Supply.  Schematic Entry: Orcad 10.3 / CAD: Pads. Spice: LTspice/SwitcherCAD III.  Project completed 22Jul2005.

 

Quinn Embedded Design, under contract at Conexant: Jan2005 â�“ Mar2005              Sr. Design Engineer (Contractor).

·         Power Supply Design / Mixed signal, Schematic Entry, Component Selection: This was a short term (9 week) contract job requiring Schematic entry with Orcad.  I was also responsible for power supply and mixed signal design, including general component selection. Technologies Employed: High Speed CMOS Logic, Analog, Mixed-Signal & Switching Power Supply.   Schematic Entry: Orcad 10.2.

 

General Dynamics under contract Sep2004 - Dec2004                                                    Design Engineer (Contractor).

·         Redesign of High Quality Audio unit: This mixed signal assignment required an initial analysis of a Mil. Spec. audio board.  A report was subsequently generated and was submitted to a committee for redesign, which was approved.  Some issues of this project were: Redesigned Ground structure of unit, including Chassis, Analog and Digital Ground, including an inner layer Ground Plane.  Redesigned Op-Amp input structures to decrease noise.  This included logistical placement of passive components to aid in decreasing noise. Previously passive components were located too far away from the + & - inputs of Op-Amps resulting in a low signal to noise ratio, which I corrected.  Other aspects addressed on this redesign were related to heat dissipation, Electret microphone input circuit design, redesign of digital potentiometer circuitry.  Also addressed illegal loading issues regarding on the on-board microcontrollerâ�™s output ports.  Schematic capture: Orcad, analysis Tools: Excel, documentation tools: Word / Visio.

Technologies Employed: High Speed CMOS Logic, Analog, Mixed-signal & Switching Power Supply.

 

Quinn Embedded Design  2004 (Jan-Aug)                                                                 Sr. Design Engineer (Contractor).

·         Custom Design of Infrared Detector, Project Lead / Manager: Designed Infrared Sensing product used in a low power battery operated motion sensing unit. I specified all components, designed all circuitry, designed the PCB, Provided BOM and worked with the C.E.M as the unit entered its production stage. 

·         Custom Design of Flow Control Gas Mixing Unit:  This assignment included selecting Flow Control / Flow Sensing devices that function under Microprocessor control.  Additional elements of this program included specifying, designing and interfacing to Power drivers, A to D converters, Closed Loop Control of gas regulation and mixing system.  Components involved in the design: Pressure sensors, Pressure controllers, Proportional Valves, DC Motors (Stepping, D.C. and A.C. Motors) their perspective drivers.  Additionally I was responsible for the design of the Peripheral Drivers, CPU, Peripheral Devices, Communications and Power Supply.

Experience Continued:

Unitec Electronics Inc.  2002-2003                                                                            Sr. Design Engineer (Contractor).

·         Design of custom circuitry, including Power Supply, Analog, Digital and Mixed Signal. Schematic Capture using Orcad. Performed laboratory tests to verify design concepts, provide documentation including, BOMs, schematics, and wiring harness diagrams. In charge of qualifying components, maintaining and organizing component documentation for Engineering and Production.

·         Commercial vending application: Designed circuitry used to control bill acceptors and coin hoppers. Was delegated Firmware responsibilities using Microchip PIC.  Firmware is written in â�˜Câ�™ using a CCS Compiler.

·         Designed carrier board for a CPU, Modem, Power Supply and Power Distribution Board, Ethernet network interface used in a type of outdoor Kiosk unit.

·         Responsible for the indoor console design to interface with the aforementioned kiosk.

·         Responsible for design (including schematic entry & layout), BOM, and production supervision of Display I/O board.  Designed intercom voice audio detection circuit. TIA/EIA-644 LVDS display interface employing microstrip layout techniques.  Revised audio power amplifier circuit.  Improved power routing on PCB.

 

Mars Electronics International. 2001-2002                                                                     Design Engineer (Contractor).

Designed custom circuitry / Component Engineering. Mentor Graphics used for schematic capture.  This was a team project of approximately 30 members.  I was delegated responsibility for power supply, motor control and some infrared sensing circuitry design.  I was also the component engineer for the group. This required compilation of BOMs and component specifications and documentation for the MRP system.  Worked closely with purchasing and outside manufacturer's representatives in order to qualify and acquire components in time for projects. My contract at MEI was extended twice and was completed, June 2002.

 

·         Designed bill acceptor circuitry: System was based on 8051 CPU and T.I. TMS320 DSP. Responsible for Power Supply, Motor control, low level infrared sensor circuit design. Oversaw laboratory experiments to verify design concepts. In many cases, I performed these tests myself with various laboratory equipment including Oscilloscopes, Spectrum Analyzers, Logic Analyzers, DVMs, and standard lab. equipment.  I also had the assignment of Component engineering for the group, this included component selection for various applications, liaison with distributors & manufacturers, preliminary Budgetary pricing, component testing.  Oversaw proper installation of new components into MRP system.

 

Analog Devices Inc. 2000-2001                                                                                                      Sr. Design Engineer.

·         Designed Modems based on the AD1803 / AD1804 chipset operating via AC-97.  Supported customerâ�™s designs with audio CODECs that operated under the AC-97 standard and supported features such as SPDIF and TOSLINK. This program was terminated soon after I started as the result of a legal issue between ADI and Silicon Laboratories Inc.

Experience Continued:

Infrared of New Jersey Inc.  1998-2000                                                                        Sr. Design Engineer / Manager.

·         Electronic Design; Hardware and Firmware for infrared sensors and communications adaptors.  Some technologies include:  High speed A-D conversion, custom RS-485 networking, Infrared networking, high gain low drift amplifier techniques used for low level infrared sensing.   Employed Medium density FPGAs in designs.  Schematics were entered with Pads Power Logic.  Oversaw PCB layout (for low noise and safety compliance).  Entered Bills of Material into corporate MRP system.  Code was written in "C" & debugged with Microchip MPLab and Ice-2000 emulator.  Helped in implementation of ISO-9001.  My experience with Ethernet helped solve company networking problems. 

 

·         Infrared Positioning System:  Multidimensional Infrared System.  Designed Hardware, Firmware,  FPGA and ran studies to verify usefulness of such a device.

·         Over Heating Sensing System:  This project involved the design of a commercial overheating sensor.  It would force an electric heater to shut-down when infrared sensor detected a thermal rise (i.e. newspaper / sock on floor begins to smolder) of an object placed directly in front of the heater.

·         Infrared Bidirectional Human Counting System: This system used multiple bipolar infrared sensors to detect and count humans walking into and out of a large doorway.

 

U.S. Robotics / 3Com Inc.     1997-1998                                                                                         Sr. Design Engineer.

·         My responsibilities included T.I. TMS320 DSP based hardware design; Analog (56K / V.90) and ISDN (fractional T1) Modems. TAS test equipment was used to test products for return-loss, BERT tests, noise tests, and other relevant impairment tests of POTs based telephony products. Designs typically depended on critical analog design practices.  Designs met requirements of international telecom impedances for compliance in several countries.  Prepared and managed PCB layout of products. Departmental interrelations were highly dependent on ISO-9001 registered procedures for which I was responsible.   This assignment did not last long as U.S. Robotics and 3Com merged in 1997, Large lay-offs began.  My group was sold to a Taiwanese company.

 

·         Supervised Off-Site Compliance and Certification testing of Several Modems: Verified productsâ�™ compliance and safety certifications to UL 1950, TUV EN60950/IEC950, FCC part-15 and FCC part-68.

·         ISDN Modem with ringing SLIC.  Design was based on a previous design with the addition of a North American Ringing Subscriber Line Interface Circuit.

·         Software Reconfigurable DAA: Designed and debugged a software selectable Modem DAA for several European countries.  This allowed for a software reconfigurable MODEM that would be compliant in several countries.

Cardinal Technologies Inc.    1995-1997                                                                        Sr. Design Engineer.

·         My responsibilities included hardware design of (33K/V.34) Analog Modems.  Designs met Part 15-B & 68 and met EN60950/IEC950 requirements for safety compliance.  TAS telecommunications test equipment was used to test products for return-loss, BERT tests, Noise and other relevant impairment tests.  I was responsible for hardware design and all aspects of my products' firmware.  The code was written in Assembly Language, Processors used were 8051 and Rockwell cores. I also designed a 33.6K High-End Modem which was feature and hardware loaded.  It contained an audio interface with the computer, logarithmic bar graph that indicated audio levels and Download / Upload Speeds.  Additionally was responsible for product cost reduction on several occasions.

Boca Research Inc.  1991-1995                                                                                                      Sr. Design Engineer.

My responsibilities included design of North American and International analog (POTs) 33K / V.34 Modems.  My products met FCC Part 15 & 68 requirements for North America.  I also assisted in the development of network and serial/parallel port products.   I was responsible for hardware design and all aspects my products' firmware.  Code was written in Assembly Language.  The processors used had 8051 and ROCKWELL cores. I assisted in other products and groups when required.

 

·         14.4 KBPS North American Internal Modem.

·         14.4 KBPS North American External Modem.

·         14.4 KBPS Japanese External Modem.

·         14.4 KBPS Japanese Internal Modem.

·         14.4 KBPS German External Modem.

·         2400 KBPS North American Internal Modem.

·         9600 KBPS North American Internal Modem.

·         Quad Serial Expansion Port (RS-232) for EISA installations in Personal Computers.

 

Military:

Air Force                                                                                                                              1971-1975 Staff Sergeant.

I attained the rank of Staff Sergeant and specialized in maintenance and repair of Tropospheric scatter and Microwave Transmitters and Receivers and associated Telemetry equipment.  Held a Secret Security Clearance, and was Honorably Discharged in 1975.

 

Education:

·         1976 Nova University - Programming Basics,  Computer Programming.

·         1972 Keesler Technical Training Center - Military Equivalent EE degree in Advanced Electronics.

·         1971 St Andrews High School - USAF GED, assigned to school.

 

Additional Information Above and Beyond Work Experience Listed Above:

My strongest areas are both Hardware (Analog / Digital / Mixed-Signal) and Embedded Firmware Engineering.  I have been the sole author of many products over the years in which I have been responsible for all Hardware, Firmware, EMI, safety certifications, BOMs and production documentation.  Strongest languages are: Assembly and â�˜Câ�™. 

 

CPU Experience: Intel 8051 family, Microchip PIC family, T.I. MSP430x,,  Rockwell 6502, 6800 family, knowledge of the Motorola 68K and hands-on experience with X86 chips, and Rockwell (now Conexant) and TMS320 DSP Modem Chip-Sets. 

 

Operating Systems: Knowledgeable and skilled with Windows (95/98/NT/ME,2000,XP) and DOS and most Windows standard applications such as Word, Excel, Outlook, etc.

 

Audio Designs: Experienced in high quality audio designs used in applications such as Live Professional Broadcast, including Broadcast Automation Equipment.  I am accomplished in the design of low distortion circuitry, employing both Op-Amps and discrete devices.  I am also familiar with Low-Noise audio preamplifiers for microphones. This includes design and installations where knowledge of shielded / balanced audio lines provide high performance audio over long hauls with no distortion, noise, or 60 Hz hum problems.  Iâ�™m familiar with Microphonic problems associated with ceramic capacitors.   I have design experience in AtoD and DtoA converters proving interface from analog to digital when required using both External and Embedded devices.

 

 

Power Supply: I offer solid understanding in power supply design, both switching and analog.  I am aware of how a switching power supply can impact high sensitivity circuitry and the measures necessary to keep this noise to a minimum.  I have designed switching power supplies with over 93% efficiency.  Iâ�™ve also been involved with Power-Supply control where high electrical noise environments could mandate an SPI interface using balanced LVDS or RS422 for high reliability applications.

 

Low Power Designs: I have designed several ultra low current battery powered designs.  Strategies for low power design include event driven Microcontrollers where the CPU was taken out of a deep sleep mode momentarily to service a  timer interrupt.  Additional low power design experience include:  low quiescent current regulators, low power Op-Amps and Comparators, Experience with CD4000 series CMOS logic.  Also, knowledge and experience of MOSFET discrete design approaches which include biasing these devices in a static mode where there is virtually no wasted energy.

 

Schematic Capture: Experienced with Schematic software.  The more notably ones include: Pads Power Logic, Orcad and Mentor Graphics (Verybest) Schematic Capture.  From time to time Iâ�™ve designed PCBs myself when resources were low.

 

Test Equipment: Familiar with laboratory test equipment including, but not limited to: Oscilloscopes, Meters, Spectrum Analyzers, Logic Analyzers,  Signal Generators and Telecommunications Test Equipment (TAS). 

 

Telephony: I have a solid understanding of POTs Telecommunications.  I have designed Modems with SLICs (Subscriber Line Interface Circuits) complying with both North American and International Standards.  I also have a solid understanding and experience with Modem & telephone DAA design strategies. This includes complex impedance issues and D.C. current specifications.  Many of my products designed over the years have been certified to both FCC Part 15 & 68 standards.

 

Networking:  Solid understanding of Ethernet networking (802.3x), and protocols, including HDLC.  This includes infrastructure wiring, impedance and cabling issues such as using UTP(Unshielded Twisted Pair) verses using STP(Shielded Twisted Pair). Familiar with some protocols including Forward error correction, CRCs, Checksums, and longitudinal parity.  Familiar with Power-Over-Ethernet (POE).  Also posses good design knowledge of USB 2.0 OTG (AKA: USB 2.0 Rev. 1a)

 

Flow Control: I am familiar with Flow Control Devices including Flow Sensors, Flow Meters, Flow Controllers, and Pressure Sensors.  These include units that interface via SPI, I2C (IIC), 0-5VDC, and 4-20 MA.

 

ISO9000: Familiar with ISO9000 general procedures and establishing ISO documentation. 

 

Documentation: Accomplished in documentation (BOMs and assembly procedures), building relations with outside contract manufacturers and distributors.  I understand the critical nature of documentation and how it affects the accuracy / production of the final end product.  I am familiar with the relationship between the O.E.M., the component distributor, and the contract assembly manufacturer and have been in charge of this process on many occasions.

 

Focusing:  I understand that staying focused on both short-term and long-term goals are critical.  Getting too side-tracked on other small projects are not beneficial for product development cycles and meeting target dates.

 

References: Available upon request.